The wafer nitrogen uvled curing system is an automated equipment that uses UVLED ultraviolet light source and nitrogen protection technology to debond the UV photosensitive tape (UV film/blue film) used after wafer slicing.
1) After the wafer slicing is completed, the UV adhesive film that fixes the wafer loses its stickiness·
2) Realize non-destructive separation of chips and adhesive films, facilitating subsequent picking and packaging,
3) Replace traditional hot air/chemical solvent debonding methods to avoid thermal damage and pollution
The Core Advantages of Nitrogen UV Curing System
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Advantage |
Instructions |
|
Cold light source without thermal damage |
UVLED light source has no infrared radiation, and the surface temperature rise of the substrate does not exceed 5 ℃, making it suitable for thermal sensitive materials |
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High Efficiency and Energy Saving |
The energy consumption is about 1/10 of traditional UV mercury lamps, and the service life exceeds 20000 hours (mercury lamps only have about 800 hours) |
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Environmental Safety |
Does not contain mercury, does not produce ozone, and meets environmental requirements |
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Accurate and controllable |
Adjustable irradiation time, light intensity, and nitrogen pressure to meet different process requirements |
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Large area uniform irradiation |
Supports 6-inch, 8-inch, and 12 inch large-sized wafers with a light uniformity of ≥ 90% |
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High degree of automation |
Supports multi-channel working modes and can be integrated into automated production lines |
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+8618924372460
live:1651063690jennifer
uvcure@uvspacelight.com
0086-18924372460